Here is a sampling of the value added services available:

• Planning Procurement & Parts Engineering
• Discrete Semiconductors Testing
• Parametric and Resistance Testing
• Component Testing & Screening
• Environmental & Mechanical Testing/Conditioning
• Particle Impact Noise Detection (P.I.N.D.)
• Programming
• Parts Marketing
• Leads Tinning
• More Services...

Planning Procurement & Parts Engineering

Total Parts Procurement
Buy-Test/Screen And Ship Complete
Sales & Engineering Support Provided

Requirement Profile Recommendations
Specification Review And Process
Procedure And/Or Specification Development

Alternate Part Search
Review Compliance For Alternate Part
Develop Plan For Compliancy

Technical Consultation
Develop Test-Screening Spec For Customer Requirement
Develop Test-Screen Procedure
Engineering Recommendations For Screening And Upgrade

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Discrete Semiconductors Testing

Transistors & Diodes

Electrical Test
Dc-Parametric Test Ac-Switching Test
Special Dynamic Test

Temperature Testing
Military Temp [-55c, +25c, +125c] Indust Igh)

Tx-Screening & Qualification (Jan & Jantx)
Tx-Screening Per Mil-Prf-19500
Qci (Mil-Prf-19500)
Group-A Group-B
Group-C Rial Temp [-40c, +25c, +85c]
Commercial Temp [0c, +25c, +70c]
Other Temp (Cold/Low, Ambient Hot/High)

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Parametric and Resistance Testing Services
Resistors, Capacitors, Inductor Relays, Connectors, Filters
DC Parametric Test
AC/Dynamic Parametric Test
Dwv-Dieletric Withstanding Voltage
Insulation Resistance
Contact Resistance

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Component Testing & Screening
Microcircuits (IC'S)

Electrical Test
DC-Parametric Test
AC-Parametric Test
Functional Test

Temperature Testing
Military Temp [-55c, +25c, +125c]
Industrial Temp [-40c, +25c, +85c]
Commercial Temp [0c, +25c, +70c]

Other Temp
Cold (Low)
Ambient Hot (High)

Screening & Qualification (Class-B)
Mil-Std-883, Method-5004, Class-B
Qci (Mil-Std-883, Method-5005, Class-B)
Group-A
Group-B
Group-C
Group-D

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Environmental & Mechanical Testing/Conditioning
Adhesion To Lead Finish
Bond Strength
Burn-In
Constant Acceleration
Die Shear
Hermetic (Fine & Gross Leak)
Humidity
Internal Water Vapor (Rga)
Immersion
Lead Integrity
Lead Torque
Life
Mechanical Shock
Moisture Resistance
Physical Dimensions
Pind
Radiography (X-Ray)
Salt Atmosphere
Sem
Stabilization Bake
Temperature Cycling
Thermal Resistance
Terminal Strength
Thermal Shock
Vibration & Shock

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Particle Impact Noise Detection (P.I.N.D.)
PIND testing equipment detects any loose foreign particles that may be present in a package. The package is placed on a shaker table where it is in intimate contact with an acoustic transducer that drives an ultrasound amplifier.  

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Programming
Process PLD-PROM-EPROM-EEPROM programming, erasure, device blank verification marking, and labeling available for quick turnaround:

PROM
Programmable-read-only-memory: A ROM which requires a programming operation. A memory device whose stored data content is established on an individual device basis through a programming process ( Usually involving the blowing of fuse links on the surface of the die). Unlike EPROMs and EEPROMs, PROMS cannot be erased and reprogrammed .

EPROM
Erasable Programmable Read Only Memory: A memory device whose content can be established through a programming process ( usually hot electrode injection) and can be totally erased by exposure to ultraviolet light for sustained periods ( typlically 30 minutes). When properly erased, the device can be reprogrammed.

EEPROM (E2PROM)
Electronically Erasable Programmable Read Only Memory: A memory device whose content can be established through a programming process (usually the tunneling of electrons across a thin layer of silicon dioxide to a floating gate). Each memory cell of an EEPROM can be individually erased by imposing a voltage to reverse the flow of electrons to move them away from the floating gate. The cell can then be reprogrammed. Both programming and erasing can be performed without removal of the device from the system in which it is used.

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Parts Marketing
Process using Military Ink and RESISTANCE TO SOLVENT TEST to Mil-Std to insure ink permanency.

Leads Tinning (Solder Dip) - Dipping of the leads of devices into molten solder in order to later facilitate soldering of the devices to circuit boards. Parts Lead Tinning and Solderability per applicable Mil-Std.

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Other Services
In-House Or Outsourced
Pld-Prom Programming
Erasure ­Labeling-Marking
Marking (Ink Or Labeled)
Resistance To Solvent Test (Marking)
External Visual
Tinning &Solderability Testing

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Please Contact Us for more information about any of our Value Added Services.

Luke Systems/Sperry Corp. provides testing services for on a wide variety of electronic parts:

Microcircuits
Digital
Linear
Memory
Hybrids
Micros
Pld
Prom
Eprom
Asic
Hybrids

Transistors
Bipolar
Fets
Ujt
Scr
Triacs

Diodes
Zeners

Capacitors
Resistors
Inductors
Coils
Transformers
Connectors

Contact Us for more information